MTP-8 APC to 4 x MDC UPC Harness, 8 Fibers, OS2, Type B
Factory-terminated MTP-8 APC to 4× MDC UPC duplex breakout harness for ultra-high-density singlemode data center interconnects, OS2 G.657.A1, LSZH jacket, Type B polarity.
MTP-8 APC to 4 x MDC UPC Harness, 8 Fibers, OS2, Type B
Factory-terminated MTP-8 APC to 4× MDC UPC duplex breakout harness for ultra-high-density singlemode interconnects in modern data centers. The singlemode MTP connector on one end breaks out to four MDC (Miniature Duplex Connector, USConec VSFF family) legs on the other end, giving an 8-fiber (Base-8) channel mapped with Type B (crossover) polarity. MDC connectors deliver twice the port density of standard LC duplex in patch panels, enabling 400G/800G migration paths without footprint expansion.
MTP-8 APC to 4 × MDC UPC Harness, 8 Fibers, OS2, Type B — VSFF MDC breakout assembly with yellow LSZH jacket
Key Features
VSFF MDC breakout: MDC duplex connectors occupy 2× the density of LC duplex in standard patch panel cutouts (3.0 mm pitch).
Base-8 (8 fibers) MTP-to-MDC breakout: ideal for high-density spine-leaf and 400G/800G aggregation layers.
Type B (crossover) polarity: standard polarity for direct connection between MTP cassettes at both ends of a link.
Low insertion loss: MTP APC ≤ 0.35 dB typical; MDC UPC ≤ 0.25 dB typical.
High return loss: APC end ≥ 60 dB; UPC end ≥ 50 dB.
Bend-insensitive OS2 fiber: G.657.A1 singlemode fiber with 7.5 mm minimum bend radius.
LSZH jacket (yellow): OFNR-rated LSZH jacket compliant with IEC 60332-3.
100% factory tested: insertion loss, return loss and endface geometry per IEC 61300-3-35; test report shipped with each assembly.
Applications
400G/800G data center backbone aggregation breakout from MTP trunk to MDC patch panels
Hyperscale and AI/ML GPU fabric high-density spine-leaf architecture
Ultra-high-density ODF frames where LC port density is insufficient
VSFF (Very Small Form Factor) connector migration from legacy LC duplex
Single-mode backbone links in colocation facilities
Compliant with IEC 61753-1, IEC 61300-3-35, TIA-568.3-E and ISO/IEC 11801-1. Each assembly ships with serial number, test report and length-specific labeling.